The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Nov. 03, 2017
Qualcomm Incorporated, San Diego, CA (US);
Chong Ding, Cary, NC (US);
Carl Hanke, Chapel Hill, NC (US);
Douglas Bruce White, Raleigh, NC (US);
Stephen Douglas Weitzel, Georgetown, TX (US);
Richard LaBarbera, Wake Forest, NC (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
According to certain aspects of the present disclosure, a semiconductor die includes a decoupling capacitor between a first interconnect metal layer and a second interconnect metal layer of the die, a first supply rail formed from the second interconnect metal layer, and a resistive metal path coupled between the decoupling capacitor and the first supply rail. The decoupling capacitor may be a metal-insulator-metal (MIM) capacitor. In some embodiments, the resistive metal path includes a plurality of elongated segments, and one or more connecting segments, wherein each of the one or more connecting segments electrically couples a respective pair of the plurality of elongated segments. In some embodiments, the resistive metal path includes multiple vias coupled in series.