The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
May. 07, 2018
Fanuc Corporation, Yamanashi, JP;
Masato Watanabe, Yamanashi, JP;
Taku Sasaki, Yamanashi, JP;
FANUC CORPORATION, Yamanashi, JP;
Abstract
A heat sink capable of dissipating heat concentrating on a chip portion of a power semiconductor device module efficiently is provided. A heat sink () includes a heat sink body () in which a power semiconductor device module () having a plurality of power semiconductor devices () is placed on a cooling surface Fand which radiates heat generated by the power semiconductor device (); and a heat dissipation structure portion () having a higher heat conductivity than the heat sink body () and capable of dissipating heat generated by the power semiconductor device (), wherein the heat dissipation structure portion () is provided at a position overlapping the power semiconductor device () disposed in the power semiconductor device module () in a direction (Z) orthogonal to the cooling surface (F) of the heat sink body ().