The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Apr. 13, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Kuniaki Yosui, Nagaokakyo, JP;

Takahiro Baba, Nagaokakyo, JP;

Yoshiyuki Mashimo, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/367 (2006.01); H01L 23/12 (2006.01); H01L 23/36 (2006.01); H01L 23/00 (2006.01); H01L 23/433 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H01L 25/10 (2006.01); H05K 1/14 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/12 (2013.01); H01L 23/36 (2013.01); H01L 23/3677 (2013.01); H01L 23/4334 (2013.01); H01L 23/5383 (2013.01); H01L 23/5389 (2013.01); H01L 24/24 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H05K 1/0204 (2013.01); H05K 1/186 (2013.01); H05K 3/4697 (2013.01); H01L 24/25 (2013.01); H01L 25/105 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/19 (2013.01); H01L 2224/2402 (2013.01); H01L 2224/24141 (2013.01); H01L 2224/24265 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33051 (2013.01); H01L 2224/33519 (2013.01); H01L 2224/73267 (2013.01); H01L 2225/1035 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19105 (2013.01); H05K 1/021 (2013.01); H05K 1/141 (2013.01); H05K 3/4069 (2013.01); H05K 3/4632 (2013.01); H05K 2201/10416 (2013.01);
Abstract

A multilayer board includes a base including insulating layers stacked in a stacking direction, and a mounting surface at an end of the base in a first direction along the stacking direction, an electronic component inside the base, and a first heat dissipator extending through at least one of the insulating layers from a surface of the electronic component located at an end of the electronic component in the first direction to the mounting surface. When a section of the first heat dissipator is defined as a first section, and a section of the first heat dissipator located farther in a second direction along the layer stacking direction than the first section is defined as a second section, there is a combination of a first section and a second section in which the second section extends farther outward than the first section when viewed from the layer stacking direction.


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