The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Jul. 11, 2017
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Yusuke Harada, Kyoto, JP;
Yasuhiro Fuwa, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 21/768 (2006.01); H01L 23/29 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 21/76871 (2013.01); H01L 23/29 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01);
Abstract
An electronic component includes a substrate having a principal surface, a chip arranged at the principal surface of the substrate, a sealing resin sealing the chip on the principal surface of the substrate, and a heat dissipation member formed on the sealing resin.