Multilayer ceramic electronic component, method of manufacturing the same, and print circuit board having the same embedded therein

Abstract

A multilayer ceramic electronic component includes: a body having first to sixth surfaces, and including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed and exposed through the third and fourth surfaces, respectively; and first and second external electrodes disposed on the third and fourth surfaces of the body, respectively, and including first and second connected portions connected to the first and second internal electrodes, respectively, and first and second band portions extending from the first and second connected portions to portions of at least one of the first and second surfaces of the body, respectively. The external electrodes include conductive layers and plating layers, respectively, and surfaces of end portions of external electrodes are flat.