The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Aug. 03, 2015
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Han Nah Jeong, Daejeon, KR;
Ha Na Lee, Daejeon, KR;
Cheol-Hee Park, Daejeon, KR;
Chee-Sung Park, Daejeon, KR;
Jae Hyun Kim, Daejeon, KR;
Shin Hee Jun, Daejeon, KR;
Ryul Lee, Daejeon, KR;
Min Ji Kim, Daejeon, KR;
Assignee:
LG Chem, Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); B32B 3/10 (2006.01); B32B 15/00 (2006.01); C08K 3/32 (2006.01); H01B 5/14 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/10 (2006.01); H05K 3/38 (2006.01); C23C 18/16 (2006.01); C23C 18/40 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); B32B 3/10 (2013.01); B32B 15/00 (2013.01); C08K 3/32 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/1641 (2013.01); C23C 18/405 (2013.01); H01B 5/14 (2013.01); H05K 1/0373 (2013.01); H05K 1/09 (2013.01); H05K 3/105 (2013.01); H05K 3/386 (2013.01); C08K 2003/329 (2013.01); Y10T 428/24802 (2015.01); Y10T 428/24851 (2015.01); Y10T 428/24909 (2015.01); Y10T 428/24917 (2015.01);
Abstract
The present invention relates to a composition for forming a conductive pattern that enables forming conductive micropatterns on various polymer resin products or resin layers by a simplified process without deformation of the polymer resin products or resin layers, and enables effectively satisfying requirements of the art, and a resin structure having a conductive pattern.