The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Feb. 01, 2017
Applicant:

Primax Electronics Ltd., Taipei, TW;

Inventors:

Mao-Hsiu Hsu, Taipei, TW;

Kuan-Pao Ting, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 9/00 (2006.01); G06K 9/00 (2006.01); H04L 29/06 (2006.01); H04W 12/06 (2009.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G06K 9/00013 (2013.01); G06K 9/00087 (2013.01); H04L 63/0861 (2013.01); H04W 12/06 (2013.01); H05K 1/0212 (2013.01); H05K 1/181 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0166 (2013.01); H05K 2201/10151 (2013.01); Y02P 70/611 (2015.11);
Abstract

A fingerprint identification module is provided for identifying a fingerprint of a finger. The fingerprint identification module includes a sensing chip and a thermally deformable layer. The thermally deformable layer is disposed over the sensing chip and includes a sensing region. When the finger is placed on the sensing region, the fingerprint of the finger is sensed by the sensing chip. If the fingerprint identification result of the fingerprint identification module fails, the thermally deformable layer is firstly changed to a molten state and then returned to a solidified state within a predetermined time period. Consequently, the finger is fixed by the thermally deformable layer.


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