The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Jul. 28, 2017
Applicant:

Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Jun Hou, Guangdong, CN;

Lixuan Chen, Guangdong, CN;

Hsiao Hsien Chen, Guangdong, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1335 (2006.01); G02B 5/30 (2006.01); G03F 7/00 (2006.01); C23F 4/00 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133528 (2013.01); C23F 4/00 (2013.01); G02B 5/3058 (2013.01); G03F 7/0002 (2013.01); G02F 2001/133548 (2013.01); H01L 21/31144 (2013.01);
Abstract

The present disclosure discloses a method of manufacturing a nanowire grid polarizer, including: sequentially laminating a first wire grid material layer, a second wire grid material layer and a third wire grid material layer on a substrate; disposing a nano photoresist array on the third wire grid material layer; etching the third wire grid material layer which is not covered by the nano photoresist array by dry-etching; etching the second wire grid material layer which is not covered by the nano photoresist array by wet-etching; etching the first wire grid material layer which is not covered by the nano photoresist array by dry-etching; and removing the nano photoresist array to obtain the nanowire grid polarizer. According to the present disclosure, by disposing multilayer wire grid material film layers having a 'sandwich' structure on the substrate, and then by segmentally using the dry-etching method and the wet-etching method in conjunction with different characteristics of materials for the different film layers, the etched thickness for each etching process is reduced, and the defects of a single dry-etching method and a single wet-etching method are avoided. Moreover the manufacture procedure thereof is simple.


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