The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Jan. 25, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Kyeong-mi Lee, Suwon-si, KR;

Jeong-ju Park, Hwaseong-si, KR;

Shi-yong Yi, Seongnam-si, KR;

Eun-sung Kim, Seoul, KR;

Seung-chul Kwon, Suwon-si, KR;

Sang-ouk Kim, Daejeon, KR;

Young-joo Choi, Daejeon, KR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01Q 70/14 (2010.01); G01Q 60/28 (2010.01); H01L 21/67 (2006.01); G01Q 60/42 (2010.01); H01L 27/108 (2006.01);
U.S. Cl.
CPC ...
G01Q 60/28 (2013.01); G01Q 60/42 (2013.01); G01Q 70/14 (2013.01); H01L 21/67288 (2013.01); H01L 27/10876 (2013.01); H01L 27/10885 (2013.01); H01L 27/10888 (2013.01);
Abstract

A method of forming a micropattern, a substrate surface inspection apparatus, a cantilever set for an atomic force microscope, and a method of analyzing a surface of a semiconductor substrate, and a probe tip the method including forming pinning patterns on a semiconductor substrate; forming a neutral pattern layer in spaces between the pinning patterns; and inspecting a surface of a guide layer that includes the pinning patterns and the neutral pattern layer by using an atomic force microscope (AFM).


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