The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Jun. 22, 2017
Applicant:

Osram Gmbh, Munich, DE;

Inventors:

Lorenzo Baldo, Giavera del Montello, IT;

Federico Poggi, Venice, IT;

Luigi Pezzato, Treviso, IT;

Aleksandar Nastov, Munich, DE;

Assignee:

OSRAM GMBH, Munich, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21S 4/24 (2016.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/12 (2006.01); H05K 3/40 (2006.01); F21V 19/00 (2006.01); H01L 33/62 (2010.01); F21Y 103/10 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 19/0015 (2013.01); H01L 33/62 (2013.01); H05K 1/092 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01); H05K 3/12 (2013.01); H05K 3/4038 (2013.01); F21S 4/24 (2016.01); F21Y 2103/10 (2016.08); F21Y 2115/10 (2016.08); H05K 3/125 (2013.01); H05K 3/1216 (2013.01); H05K 3/1275 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01); H05K 2203/107 (2013.01);
Abstract

According to the present disclosure, a support structure for lighting devices, e.g. LED lighting devices, is provided with an electrically insulating core layer having a first and a second mutually opposed surfaces, with mounting locations for electrically-powered light radiation sources on the first surface, a network of electrically conductive lines printed on said first surface, at least some of said electrically conductive lines extending between the mounting locations and fixed locations on the first surface, and electrical distribution lines of electrically conductive material on the second surface of the core layer, and electrically conductive vias extending through core layer and electrically coupling the electrical distribution lines on the second surface with the electrically conductive lines at said fixed locations on the first surface.


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