The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Oct. 16, 2015
Applicant:

The Japan Steel Works, Ltd., Tokyo, JP;

Inventors:

Akio Ono, Hiroshima, JP;

Akira Yasue, Hiroshima, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D06N 3/00 (2006.01); D06N 3/12 (2006.01); D03D 25/00 (2006.01); B29C 70/30 (2006.01); B29C 70/50 (2006.01); B29B 15/10 (2006.01); B29K 77/00 (2006.01); B29K 307/04 (2006.01);
U.S. Cl.
CPC ...
D06N 3/0084 (2013.01); B29B 15/105 (2013.01); B29C 70/30 (2013.01); B29C 70/50 (2013.01); B29C 70/506 (2013.01); D03D 25/00 (2013.01); D06N 3/0015 (2013.01); D06N 3/125 (2013.01); B29K 2077/00 (2013.01); B29K 2307/04 (2013.01); B29K 2313/02 (2013.01); B29K 2995/0063 (2013.01); D06N 2201/087 (2013.01); D06N 2203/065 (2013.01);
Abstract

The present invention provides a fiber-reinforced resin intermediate material, including not only a thermoplastic resin but also a thermosetting resin, in which defects such as voids are difficult to be generated and which is excellent in shaping ability; and a method for manufacturing the same. The fiber-reinforced resin intermediate material according to the present invention is a fiber-reinforced resin intermediate material formed by attaching a resin to an outer surface part of a reinforcing fiber substrate formed of reinforcing fibers subjected to opening and heating the resin to a temperature equal to or higher than the melting point of the resin to impregnate the reinforcing fiber substrate with the resin, wherein the reinforcing fiber substrate has void space that is opened on an outer surface thereof and the resin is in a semi-impregnated state.


Find Patent Forward Citations

Loading…