The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10351965 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 16, 2019

Filed:

Apr. 16, 2014
Applicant:

Oriental Electro Plating Corporation, Kobe-shi, Hyogo, JP;

Inventor:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/50 (2006.01); C25D 5/12 (2006.01); H01R 13/03 (2006.01); C25D 3/12 (2006.01); C25D 3/40 (2006.01); C25D 3/46 (2006.01); C25D 3/48 (2006.01); C25D 3/50 (2006.01); C25D 5/48 (2006.01); C25F 1/00 (2006.01); C25F 5/00 (2006.01); C25D 3/30 (2006.01);
U.S. Cl.
CPC ...
C25D 5/12 (2013.01); C25D 3/12 (2013.01); C25D 3/40 (2013.01); C25D 3/46 (2013.01); C25D 3/48 (2013.01); C25D 3/50 (2013.01); C25D 5/48 (2013.01); C25D 5/505 (2013.01); C25F 1/00 (2013.01); C25F 5/00 (2013.01); H01R 13/03 (2013.01); C25D 3/30 (2013.01);
Abstract

Provided are: a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, and wherein a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.


Find Patent Forward Citations

Takahashi, Hiroyoshi. (2019). Method for producing plated material, and plated material (U.S. Patent No. 10351965). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10351965

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