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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10351728 B1

PDFFull Text
Date of Patent:
Jul. 16, 2019

Filed:

Jan. 10, 2014

Thermosetting resin composition, method of producing thermal conductive sheet, and power module

Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Mariko Takahara, Chiyoda-ku, JP;

Kenji Mimura, Chiyoda-ku, JP;

Yurie Nakamura, Chiyoda-ku, JP;

Motoki Masaki, Chiyoda-ku, JP;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Brieann R Johnston

Int. Cl.
CPC ...
C08K 3/38 (2006.01); B29C 41/00 (2006.01); B29C 41/02 (2006.01); B29L 31/34 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); B29K 101/10 (2006.01); B29K 105/16 (2006.01); B29K 509/04 (2006.01); C01B 21/064 (2006.01); C08L 101/00 (2006.01); C09D 163/00 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); B29C 41/003 (2013.01); B29C 41/02 (2013.01); C08K 3/38 (2013.01); C08L 101/00 (2013.01); H01L 21/4871 (2013.01); H01L 23/36 (2013.01); H01L 23/3737 (2013.01); H01L 23/4334 (2013.01); H01L 23/49575 (2013.01); H01L 24/29 (2013.01); B29K 2101/10 (2013.01); B29K 2105/16 (2013.01); B29K 2509/04 (2013.01); B29K 2995/0013 (2013.01); B29L 2031/34 (2013.01); C01B 21/064 (2013.01); C01B 21/0648 (2013.01); C08K 2003/385 (2013.01); C08K 2201/016 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32245 (2013.01);
Abstract

A thermosetting resin composition containing a thermosetting resin and an inorganic filler, in which the inorganic filler contains secondary sintered particles (A) formed of primary particles of boron nitride, which have an aspect ratio of 10 to 20, and secondary sintered particles (B) formed of the primary particles of boron nitride, which have an aspect ratio of 2 to 9. The thermosetting resin composition can produce a thermal conductive sheet that has excellent filling property of the inorganic filler, and excellent thermal conductivity, adhesiveness and electrical insulating properties.

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