The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

May. 30, 2017
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Tomoyuki Mizunashi, Annaka, JP;

Yuusuke Takamizawa, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/06 (2006.01); C08G 77/06 (2006.01); C08G 77/14 (2006.01); C08G 77/42 (2006.01); C09K 11/59 (2006.01); C08K 5/17 (2006.01); C09D 183/06 (2006.01); C08G 77/16 (2006.01); C08G 77/18 (2006.01); C08L 83/00 (2006.01); C08G 77/00 (2006.01); C09K 11/02 (2006.01);
U.S. Cl.
CPC ...
C08L 83/06 (2013.01); C08G 77/06 (2013.01); C08G 77/14 (2013.01); C08G 77/16 (2013.01); C08G 77/18 (2013.01); C08G 77/42 (2013.01); C08G 77/70 (2013.01); C08G 77/80 (2013.01); C08K 5/17 (2013.01); C08L 83/00 (2013.01); C09D 183/06 (2013.01); C09K 11/02 (2013.01); C09K 11/59 (2013.01); C08K 2201/00 (2013.01);
Abstract

A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an RSiOunit, 30 to 80 mol % of an (R)SiOunit, and 1 to 30 mol % of an (R)SiOunit. At least a part of the (R)SiOunit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.


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