The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Nov. 06, 2015
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Koji Furukawa, Ehime, JP;

Atsuhito Arai, Ehime, JP;

Hiroaki Sakata, Ehime, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); C08L 63/00 (2006.01); C08G 59/56 (2006.01); B32B 27/38 (2006.01); C08G 59/40 (2006.01); C08G 59/50 (2006.01); C08J 5/04 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/4035 (2013.01); C08G 59/5033 (2013.01); C08G 59/56 (2013.01); C08J 5/04 (2013.01); C08J 5/24 (2013.01); C08J 2363/00 (2013.01); C08J 2481/06 (2013.01); C08L 2201/08 (2013.01);
Abstract

A epoxy resin composition includes a given epoxy resin [A], an aromatic amine compound [B], an organic acid hydrazide compound [C] having a structural formula represented by general formula (I) or (II) (X is a structure selected from among monocyclic and polycyclic aromatic ring structures, polycyclic aromatic ring structures, and aromatic heterocyclic structures and optionally has, as a substituent, any of Cor lower alkyl groups, a hydroxy group, and an amino group), and a thermoplastic resin [D], wherein the amount of the constituent element [C] is 1-25 parts by mass per 100 parts by mass of the constituent element [A], the epoxy resin composition, after having been held at 80° C. for 2 hours, having a viscosity which is up to 2.0 times the initial viscosity at 80° C.


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