The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Nov. 10, 2014
Applicant:

Jfe Chemical Corporation, Tokyo, JP;

Inventor:

Kazuya Takemura, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/06 (2006.01); C08G 8/04 (2006.01); C08L 61/06 (2006.01); C08G 65/48 (2006.01); C08K 5/13 (2006.01);
U.S. Cl.
CPC ...
C08G 59/063 (2013.01); C08G 8/04 (2013.01); C08G 65/485 (2013.01); C08L 61/06 (2013.01); C08L 63/00 (2013.01); C08G 2261/3325 (2013.01); C08G 2261/3424 (2013.01); C08K 5/13 (2013.01);
Abstract

A phenolic resin composition and an epoxy resin composition from which a cured epoxy resin having excellent heat resisting properties and a low dielectric constant can be produced. The phenolic resin composition contains a modified phenolic resin and a tetrakisphenolethane compound, the modified phenolic resin being prepared by condensation of a cyclic hydrocarbon compound having two or more unsaturated bonds and a compound having a phenolic hydroxyl group, in which the content of the tetrakisphenolethane compound is 3% to 60% by mass with respect to the total content of the modified phenolic resin and the tetrakisphenolethane compound. The epoxy resin composition is prepared by epoxidizing the phenolic resin composition. The cured epoxy resin is prepared by allowing the epoxy resin composition to react with a hardener.


Find Patent Forward Citations

Loading…