The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Mar. 31, 2015
Applicant:
Mitsuboshi Diamond Industrial Co., Ltd., Settsu, Osaka, JP;
Inventor:
Hiroshi Soyama, Settsu, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 33/033 (2006.01); C03B 33/037 (2006.01); B28D 5/00 (2006.01); B28D 1/22 (2006.01); C03B 33/023 (2006.01);
U.S. Cl.
CPC ...
C03B 33/033 (2013.01); B28D 1/225 (2013.01); B28D 5/00 (2013.01); B28D 5/0011 (2013.01); C03B 33/023 (2013.01); C03B 33/037 (2013.01); Y10T 225/12 (2015.04); Y10T 225/325 (2015.04);
Abstract
A cutter edge is caused to slide to generate a plastic deformation on a first surface of a brittle substrate, thus forming a trench line. The trench line is formed so as to obtain a crack-free state in which the brittle substrate seamlessly continues in a direction intersecting the trench line directly below the trench line. The crack-free state is then maintained. A crack of the brittle substrate in its thickness direction is extended along the trench line to form a crack line. The brittle substrate is divided along the crack line.