The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Mar. 27, 2018
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Shingo Okushima, Kawasaki, JP;
Satoshi Oikawa, Yokohama, JP;
Satoshi Kimura, Kawasaki, JP;
Tatsurou Mori, Yokohama, JP;
Kengo Umeda, Tokyo, JP;
Masataka Sakurai, Kawasaki, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/045 (2006.01); B41J 2/14 (2006.01); B41J 2/155 (2006.01);
U.S. Cl.
CPC ...
B41J 2/04541 (2013.01); B41J 2/0458 (2013.01); B41J 2/04581 (2013.01); B41J 2/14024 (2013.01); B41J 2/14072 (2013.01); B41J 2/155 (2013.01); B41J 2/1601 (2013.01); B41J 2/1607 (2013.01); B41J 2/1623 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/12 (2013.01); B41J 2202/13 (2013.01); B41J 2202/20 (2013.01); B41J 2202/21 (2013.01);
Abstract
There is provided an elongated liquid ejection head capable of voltage drop suppression and high-speed ejection operation. For this purpose, in each of flexible circuits electrically connecting element substrates to electrical substrates, a width Wa on a side connected to the electrical substrate is smaller than the width of another area.