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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10350869 B1

PDFFull Text
Date of Patent:
Jul. 16, 2019

Filed:

Aug. 11, 2017

Fingerprint identification module and method for manufacturing the same

Applicant:

Shenzhen Goodix Technology Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Baoquan Wu, Guangdong, CN;

Wei Long, Guangdong, CN;

Assignee:

SHENZHEN GOODIX TECHNOLOGY CO., LTD., Shenzhen, CN;

Attorney:

Heslin Rothenberg Farley & Mesiti P.C.

Primary Examiner:

Brian Werner

Int. Cl.
CPC ...
G06K 9/20 (2006.01); B32B 37/12 (2006.01); G06K 9/00 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01); B32B 37/00 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 38/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1284 (2013.01); G06K 9/0002 (2013.01); G06K 9/00013 (2013.01); G06K 9/00053 (2013.01); H01L 21/50 (2013.01); H01L 24/92 (2013.01); B32B 37/003 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 38/0004 (2013.01); B32B 2305/72 (2013.01); B32B 2457/00 (2013.01); H01L 23/3121 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/181 (2013.01);
Abstract

The present disclosure discloses a fingerprint identification module and a method for manufacturing the same, and relates to the field of fingerprint identification technologies. The fingerprint identification module is obtained by dicing a board-level module, and includes a fingerprint identification chip, a filling material, a color coating and a cover. The color coating is disposed between the filling material and the cover, and the fingerprint identification chip is inversely attached in a hollow area of the filling material in a vacuum environment. The fingerprint identification module has a simple structure and is easy to manufacture. By using the method, the bubbles between the fingerprint identification chip and the cover are effectively eliminated, and the manufacture efficiency of the fingerprint identification module is improved.

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