The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Feb. 20, 2017
Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Hans-Georg Kinzelmann, Pulheim, DE;

Michael Gierlings, Hilden, DE;

Assignee:

HENKEL AG & CO. KGAA, Dusseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 37/00 (2006.01); B32B 37/12 (2006.01); B32B 38/00 (2006.01); B32B 38/18 (2006.01); B32B 15/08 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B32B 21/08 (2006.01); B32B 27/10 (2006.01); B32B 27/30 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 37/10 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 21/08 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/302 (2013.01); B32B 27/304 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 37/0007 (2013.01); B32B 37/0053 (2013.01); B32B 37/10 (2013.01); B32B 37/12 (2013.01); B32B 38/0036 (2013.01); B32B 38/18 (2013.01); B32B 2270/00 (2013.01); B32B 2307/546 (2013.01); B32B 2405/00 (2013.01);
Abstract

The invention relates to: a method for adhesively bonding two substrates, in which a first substrate, which contains a thermoplastic, is transported by way of at least one supporting conveyor belt through a heating zone in which the surface of said substrate is softened, and then the second substrate, which has an adhesive layer, is laminated onto the softened surface of the first substrate and pressed together therewith; a composite body obtainable in this manner, in which the two substrates are bonded by a flexible, thin adhesive layer; and a device for adhesively bonding these two substrates by means of the described method.


Find Patent Forward Citations

Loading…