The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Jan. 16, 2015
Applicant:

Kba-notasys SA, Lausanne, CH;

Inventors:

Aurélie Berthon, St-Prex, CH;

Johannes Georg Schaede, Würzburg, DE;

Assignee:

KBA-NOTASYS SA, Lausanne, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D21H 27/32 (2006.01); B29C 70/74 (2006.01); D21H 21/40 (2006.01); B42D 25/29 (2014.01); B29D 11/00 (2006.01); B29K 711/12 (2006.01); B29K 711/10 (2006.01);
U.S. Cl.
CPC ...
B29C 70/745 (2013.01); B29D 11/00278 (2013.01); B29D 11/00298 (2013.01); B42D 25/29 (2014.10); D21H 21/40 (2013.01); B29K 2711/10 (2013.01); B29K 2711/12 (2013.01);
Abstract

There is described a method of creating a transparent window (W*) in a security, especially paper, substrate () for security printing applications, the method comprising the steps of (i) providing a security substrate (), (ii) forming an opening (*) into and through the security substrate (), and (iii) filling the opening (*) with transparent material () thereby forming the transparent window (W*). The filling of the opening (*) with the transparent material () is carried out in a state where the opening (*) is open on both sides of the security substrate () and extends through the security substrate (), the filling of the opening (*) including the application of a first side (I) of the security substrate () against a supporting surface (A) of a supporting member () in such a way as to block one side of the opening (*), while the transparent material () is applied inside the opening (*) from the other side (II) of the security substrate (). Advantageously, the method further comprises the step of forming a field of lenses (L) on one side of the transparent window (W*), in particular by replicating the field of lenses (L) directly into the transparent material () filling the opening (*). Also described is a suitable device designed to fill the opening (*) with the transparent material ().


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