The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Dec. 03, 2015
Smith International, Inc., Houston, TX (US);
Liang Zhao, Spring, TX (US);
Xiaoge Gan, Houston, TX (US);
Yahua Bao, Orem, UT (US);
Yuri Y. Burhan, Spring, TX (US);
Youhe Zhang, Spring, TX (US);
J. Daniel Belnap, Lindon, UT (US);
Zhijun Lin, The Woodlands, TX (US);
SMITH INTERNATIONAL, INC., Houston, TX (US);
Abstract
Methods for joining an ultra-hard body, such as a thermally stable polycrystalline diamond (TSP) body, to a substrate and mitigating the formation of high stress concentration regions between the ultra-hard body and the substrate. One method includes covering at least a portion of the ultra-hard body with an intermediate layer, placing the ultra-hard body and the intermediate layer in a mold, filling a remaining portion of mold with a substrate material including a matrix material and a binder material such that the intermediate layer is disposed between the ultra-hard body and the substrate material, and heating the mold to an infiltration temperature configured to melt the binder material and form the substrate.