The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Apr. 07, 2014
Applicant:

Us Synthetic Corporation, Orem, UT (US);

Inventors:

David P. Miess, Highland, UT (US);

Kenneth E. Bertagnolli, Riverton, UT (US);

Damon B. Crockett, Mapleton, UT (US);

Arnold D. Cooper, Mapleton, UT (US);

Assignee:

US SYNTHETIC CORPORATION, Orem, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 3/06 (2006.01); B24D 18/00 (2006.01); B32B 18/00 (2006.01); B24D 3/00 (2006.01); C04B 35/56 (2006.01); C04B 37/00 (2006.01); C04B 37/02 (2006.01); C22C 26/00 (2006.01); F16C 33/04 (2006.01); C04B 35/528 (2006.01); C04B 35/645 (2006.01); E21B 10/567 (2006.01); E21B 10/573 (2006.01); C04B 35/5831 (2006.01); B22F 5/00 (2006.01);
U.S. Cl.
CPC ...
B24D 3/007 (2013.01); B01J 3/062 (2013.01); B24D 18/0009 (2013.01); B32B 18/00 (2013.01); C04B 35/528 (2013.01); C04B 35/5607 (2013.01); C04B 35/5626 (2013.01); C04B 35/5831 (2013.01); C04B 35/645 (2013.01); C04B 37/006 (2013.01); C04B 37/026 (2013.01); C22C 26/00 (2013.01); E21B 10/567 (2013.01); E21B 10/5735 (2013.01); F16C 33/043 (2013.01); B01J 2203/063 (2013.01); B01J 2203/0655 (2013.01); B22F 2005/001 (2013.01); C04B 2235/386 (2013.01); C04B 2235/3839 (2013.01); C04B 2235/3847 (2013.01); C04B 2235/405 (2013.01); C04B 2235/427 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/96 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/08 (2013.01); C04B 2237/083 (2013.01); C04B 2237/086 (2013.01); C04B 2237/12 (2013.01); C04B 2237/363 (2013.01); C04B 2237/401 (2013.01); C04B 2237/58 (2013.01); C04B 2237/61 (2013.01); F16C 2206/04 (2013.01); F16C 2352/00 (2013.01);
Abstract

Embodiments relate to polycrystalline diamond compacts ('PDCs') that are less susceptible to liquid metal embrittlement damage due to the use of at least one transition layer between a polycrystalline diamond ('PCD') layer and a substrate. In an embodiment, a PDC includes a PCD layer, a cemented carbide substrate, and at least one transition layer bonded to the substrate and the PCD layer. The at least one transition layer is formulated with a coefficient of thermal expansion (“CTE”) that is less than a CTE of the substrate and greater than a CTE of the PCD layer. At least a portion of the PCD layer includes diamond grains defining interstitial regions and a metal-solvent catalyst occupying at least a portion of the interstitial regions. The diamond grains and the catalyst collectively exhibit a coercivity of about 115 Oersteds or more and a specific magnetic saturation of about 15 Gauss·cm/grams or less.


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