The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Oct. 24, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Victor Alvarez, Haverstraw, NY (US);

Pierre Y. Beaulieu, Granby, CA;

Kang-Wook Lee, Yorktown Heights, NY (US);

Jae-Woong Nah, Closter, NJ (US);

Lavanya Turlapati, White Plains, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/00 (2006.01); B23K 35/36 (2006.01); B23K 1/00 (2006.01); B23K 35/362 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); B23K 1/008 (2006.01); B23K 1/012 (2006.01);
U.S. Cl.
CPC ...
B23K 35/3612 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/012 (2013.01); B23K 35/362 (2013.01); H01L 21/563 (2013.01); H01L 24/81 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81009 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/06 (2013.01); H01L 2924/20104 (2013.01); H01L 2924/20105 (2013.01); H01L 2924/20106 (2013.01); H01L 2924/20107 (2013.01);
Abstract

A flux formulation includes an activator and a protic solvent. The activator may be glutaric acid, levulinic acid, 2-ketobutyric acid, 2-oxovaleric acid, or mixtures thereof. Suitable protic solvents include alkanediol, alkoxy propanol and alkoxy ethanol. The flux formulation may be a no-clean flux formulation that may be used in the soldering of electronic circuit board assemblies, for example, in conjunction with a support fixture having a planar back surface that minimizes vibrations during processing that might otherwise cause misalignment between a chip and a substrate prior to solder reflow.


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