The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Aug. 24, 2015
Applicant:

The Regents of the University of Michigan, Ann Arbor, MI (US);

Inventors:

Jyotirmoy Mazumder, Ann Arbor, MI (US);

Jeongyong Choi, Ann Arbor, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/34 (2014.01); B23K 26/342 (2014.01); B23K 26/354 (2014.01); B23K 26/03 (2006.01); B23K 26/08 (2014.01); B23K 26/70 (2014.01); B23K 26/144 (2014.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01); B23K 26/00 (2014.01); C22F 1/10 (2006.01); B23K 26/346 (2014.01); B23K 101/00 (2006.01); B23K 103/08 (2006.01); B23K 103/18 (2006.01); B23P 15/04 (2006.01);
U.S. Cl.
CPC ...
B23K 26/342 (2015.10); B23K 26/0006 (2013.01); B23K 26/034 (2013.01); B23K 26/083 (2013.01); B23K 26/0861 (2013.01); B23K 26/0869 (2013.01); B23K 26/0884 (2013.01); B23K 26/144 (2015.10); B23K 26/34 (2013.01); B23K 26/346 (2015.10); B23K 26/354 (2015.10); B23K 26/702 (2015.10); B23K 26/703 (2015.10); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); C22F 1/10 (2013.01); B23K 2101/001 (2018.08); B23K 2103/08 (2018.08); B23K 2103/26 (2018.08); B23P 15/04 (2013.01);
Abstract

A method and apparatus for direct writing of single crystal super alloys and metals. The method including heating a substrate to a predetermined temperature below its melting point; using a laser to form a melt pool on a surface of the substrate, wherein the substrate is positioned on a base plate, and wherein the laser and the base plate are movable relative to each other, the laser being used for direct metal deposition; introducing a superalloy powder to the melt pool; and controlling the temperature of the melt pool to maintain a predetermined thermal gradient on a solid and liquid interface of the melt pool so as to form a single crystal deposit on the substrate. The apparatus configured to generally achieve the aforementioned method.


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