The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Sep. 30, 2014
Applicant:

Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;

Inventors:

Yoshitsugu Tatsuzawa, Tokyo, JP;

Tomonori Kunieda, Tokyo, JP;

Kenichi Mori, Tokyo, JP;

Hideki Fujii, Tokyo, JP;

Kazuhiro Takahashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21B 1/02 (2006.01); B21B 3/00 (2006.01); C22C 1/02 (2006.01); C22C 14/00 (2006.01); B32B 15/01 (2006.01); B22D 15/00 (2006.01); B22D 25/00 (2006.01); B22D 19/16 (2006.01); B22D 19/08 (2006.01); B22D 23/10 (2006.01); B22D 21/00 (2006.01); B22D 23/06 (2006.01); B22D 21/06 (2006.01); B32B 15/04 (2006.01); C22C 1/10 (2006.01); B32B 1/08 (2006.01); B21B 1/22 (2006.01); C22C 1/04 (2006.01); B32B 5/14 (2006.01); C23C 6/00 (2006.01); C23C 30/00 (2006.01); C23C 20/00 (2006.01); C23C 10/60 (2006.01); C23C 10/30 (2006.01); C23C 10/28 (2006.01); C23C 20/06 (2006.01); C23C 20/04 (2006.01); C23C 20/02 (2006.01); C22B 9/22 (2006.01); C22B 9/16 (2006.01); C22B 9/20 (2006.01); C23C 24/10 (2006.01); C22F 1/18 (2006.01);
U.S. Cl.
CPC ...
B21B 1/02 (2013.01); B21B 1/22 (2013.01); B21B 3/00 (2013.01); B22D 15/00 (2013.01); B22D 19/08 (2013.01); B22D 19/16 (2013.01); B22D 21/005 (2013.01); B22D 21/06 (2013.01); B22D 23/06 (2013.01); B22D 23/10 (2013.01); B22D 25/00 (2013.01); B32B 1/08 (2013.01); B32B 5/14 (2013.01); B32B 15/01 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); C22B 9/16 (2013.01); C22B 9/20 (2013.01); C22B 9/223 (2013.01); C22B 9/225 (2013.01); C22B 9/226 (2013.01); C22B 9/228 (2013.01); C22C 1/02 (2013.01); C22C 1/0458 (2013.01); C22C 1/1036 (2013.01); C22C 14/00 (2013.01); C22F 1/183 (2013.01); C23C 6/00 (2013.01); C23C 10/28 (2013.01); C23C 10/30 (2013.01); C23C 10/60 (2013.01); C23C 20/00 (2013.01); C23C 20/02 (2013.01); C23C 20/04 (2013.01); C23C 20/06 (2013.01); C23C 24/106 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); B21B 2001/022 (2013.01); B21B 2001/028 (2013.01); B21B 2001/225 (2013.01); B32B 2311/18 (2013.01); Y10T 428/12458 (2015.01); Y10T 428/12806 (2015.01); Y10T 428/12812 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/26 (2015.01);
Abstract

Provided is a titanium cast product made of commercially pure titanium, the titanium cast product being produced by electron-beam remelting or plasma arc melting, comprising: a melted and resolidified layer in a range of 1 mm or more in depth at a surface serving as a surface to be rolled, the melted and resolidified layer being obtained by adding one or more kinds of βstabilizer elements to the surface and melting and resolidifying the surface. An average value of β stabilizer element(s) concentration in a range of within 1 mm in depth is higher than βstabilizer element(s) concentration in a base material by, in mass %, equal to or more than 0.08 mass % and equal to or less than 1.50 mass %. As the material containing the β stabilizer element, powder, a chip, wire, or foil is used. As means for melting a surface layer, electron-beam heating and plasma arc heating are used.


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