The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Sep. 04, 2014
Applicant:

Fuji Corporation, Chiryu-shi, JP;

Inventor:

Kenji Hara, Kariya, JP;

Assignee:

FUJI CORPORATION, Chiryu-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); H05K 13/04 (2006.01); H05K 13/00 (2006.01); H05K 13/08 (2006.01);
U.S. Cl.
CPC ...
H05K 13/046 (2013.01); H05K 13/0015 (2013.01); H05K 13/0408 (2013.01); H05K 13/0413 (2013.01); H05K 13/0417 (2013.01); H05K 13/08 (2013.01); H05K 13/082 (2018.08); Y10T 29/49004 (2015.01); Y10T 29/49131 (2015.01); Y10T 29/53191 (2015.01);
Abstract

Control deviceof component mounterperforms control such that after a component supplied by reel unitis picked up by nozzleof mounting headand before the component is mounted on board, the component is temporarily placed at a specified position of temporary placement surface. Also, control device, after performing control such that the component is temporarily placed at the specified position, determines whether the component has actually been temporarily placed at the specified position based on the pressure state at a hole provided at the specified position of temporary placement surfaceto which negative pressure is being supplied, and performs processing according to the determination result. Because the determination of whether the component has actually been temporarily placed is based on the pressure state of the hole provided in temporary placement surface, the determination is performed rapidly compared to a case in which the presence of the component is checked by analyzing an image of temporary placement surfacecaptured from above.


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