The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Sep. 12, 2014
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Philip H. Thompson, Solon, IA (US);

Larry D. Pottebaum, Marion, IA (US);

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); H01L 23/31 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0088 (2013.01); H01L 23/552 (2013.01); H01L 24/97 (2013.01); H05K 3/3405 (2013.01); H01L 23/3121 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/97 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/3025 (2013.01); H05K 3/0052 (2013.01); H05K 3/3442 (2013.01); H05K 2201/10204 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10636 (2013.01); Y02P 70/611 (2015.11); Y10T 29/4913 (2015.01); Y10T 29/49144 (2015.01);
Abstract

According to certain aspects, a circuit board panel includes a first module circuit board and a second module circuit board arranged to define a space that runs between a first portion of the periphery of the first module circuit board and a portion of the periphery of the second module circuit board; and a plurality of shield components each extending across the space and including a first conductive portion mounted along the first portion of the periphery of the first module circuit board, a second conductive portion mounted along the portion of the periphery of the second module circuit board, and a non-conductive portion extending between the first conductive portion and the second conductive portion, the first and second conductive portions of each of the plurality of shield components configured to provide electromagnetic shielding for at least one electronic component mounted on the first and second module circuit boards, respectively.


Find Patent Forward Citations

Loading…