The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Apr. 17, 2014
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Chee-Sung Park, Daejeon, KR;

Han Nah Jeong, Daejeon, KR;

Sang Yun Jung, Daejeon, KR;

Cheol-Hee Park, Daejeon, KR;

Chan Yeup Chung, Daejeon, KR;

Jae Hyun Kim, Daejeon, KR;

Shin Hee Jun, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/00 (2006.01); H05K 3/10 (2006.01); H01B 1/22 (2006.01); C23C 18/16 (2006.01); H05K 3/18 (2006.01); C08K 3/22 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); C23C 18/20 (2006.01); H05K 1/03 (2006.01); C23C 18/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/105 (2013.01); C08K 3/22 (2013.01); C23C 18/161 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/1641 (2013.01); C23C 18/1658 (2013.01); C23C 18/204 (2013.01); H01B 1/22 (2013.01); H05K 1/0296 (2013.01); H05K 1/09 (2013.01); H05K 3/0014 (2013.01); H05K 3/185 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2248 (2013.01); C23C 18/405 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0236 (2013.01); H05K 2201/09118 (2013.01); H05K 2203/107 (2013.01);
Abstract

The present invention relates to a composition for forming a conductive pattern, which is able to form a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simple process, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern, including a polymer resin; and a non-conductive metal compound containing a first metal and a second metal, in which the non-conductive metal compound has a three-dimensional structure containing a plurality of first layers that contains at least one metal of the first and second metals and has edge-shared octahedrons two-dimensionally connected to each other, and a second layer that contains a metal different from that of the first layer and is arranged between the neighboring first layers; and a metal core containing the first or second metal or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.


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