The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
May. 02, 2012
Ji Su Kim, Seoul, KR;
Nam Hee Kim, Seoul, KR;
Hye Sun Yoon, Seoul, KR;
IL Sang Maeng, Seoul, KR;
Sang Seon Ha, Seoul, KR;
Ji Su Kim, Seoul, KR;
Nam Hee Kim, Seoul, KR;
Hye Sun Yoon, Seoul, KR;
Il Sang Maeng, Seoul, KR;
Sang Seon Ha, Seoul, KR;
LG INNOTEK CO., LTD., Seoul, KR;
Abstract
Provided is a method for manufacturing a printed circuit board. The method for manufacturing the printed circuit board includes applying an adhesive on a support board, attaching an electronic device on the adhesive, forming an insulation layer for burying the electronic device, separating the insulation layer from the support board, forming a lower insulation layer under the insulation layer, and forming a via connected to terminals of the electronic device in the insulation layer or the lower insulation layer. Thus, since an adhesion material of an adhesion film does not remain between the internal circuit patterns, and the internal circuit patterns are not stripped by an adhesion force of the adhesion film, device reliability may be secured.