The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Jul. 25, 2017
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventor:

Priyatharshan Pathmanathan, Wake Forest, NC (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); G06F 13/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0236 (2013.01); G06F 13/4086 (2013.01); H01L 23/5227 (2013.01); H01L 23/5286 (2013.01); H05K 1/025 (2013.01); H05K 1/0213 (2013.01); H05K 1/0253 (2013.01); H05K 1/0298 (2013.01); H05K 1/0225 (2013.01); H05K 2201/029 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/10159 (2013.01);
Abstract

A system includes: a printed circuit board having a plurality of conductive traces; a processing device coupled to the printed circuit board and in electrical communication with the plurality of conductive traces; a first memory module and a second memory module in electrical communication with the plurality of conductive traces and sharing channels of the conductive traces, wherein the first memory module is physically more proximate to the processing device than is the second memory module; and an electronic band gap (EBG) structure physically disposed in an area between the first memory module and the second memory module.


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