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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10349512 B1

PDFFull Text
Date of Patent:
Jul. 09, 2019

Filed:

Dec. 04, 2017

High-frequency module

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Yoshihito Otsubo, Kyoto, JP;

Issei Yamamoto, Kyoto, JP;

Takuya Murayama, Kyoto, JP;

Tadashi Nomura, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Abhishek M Rathod

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/00 (2006.01); H01L 23/12 (2006.01); H01L 23/28 (2006.01); H01L 25/04 (2014.01); H01L 25/18 (2006.01); H05K 3/46 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 5/06 (2006.01); H05K 9/00 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H01L 23/00 (2013.01); H01L 23/12 (2013.01); H01L 23/28 (2013.01); H01L 23/3121 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 25/04 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H05K 1/02 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/46 (2013.01); H05K 5/065 (2013.01); H05K 9/003 (2013.01); H05K 9/0022 (2013.01); H01L 21/56 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/50 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H05K 3/284 (2013.01); H05K 3/341 (2013.01); H05K 2201/093 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/107 (2013.01);
Abstract

A high-frequency module includes: a multilayer wiring board; a plurality of components mounted on an upper surface of the multilayer wiring board; a sealing resin layer laminated on the upper surface of the multilayer wiring board and sealing the plurality of components; a shield wall disposed within the sealing resin layer and between the predetermined components; and a surface layer conductor disposed between the upper surface of the multilayer wiring board and the shield wall so as to overlap the shield wall in a plan view of the multilayer wiring board. The shield wall is formed in a polyline shape having bent portions in the plan view, and has, at the bent portions, projection portions penetrating the surface layer conductor.

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