The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Feb. 11, 2016
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Jin Hyong Lim, Daejeon, KR;

Jin Hyuk Min, Daejeon, KR;

Ki-Hwan Kim, Daejeon, KR;

Chan Hyoung Park, Daejeon, KR;

Ilha Lee, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/14 (2006.01); G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0213 (2013.01); G06F 3/041 (2013.01); H05K 1/0274 (2013.01); H05K 1/0306 (2013.01); H05K 3/14 (2013.01); G06F 2203/04103 (2013.01);
Abstract

The present application relates to a conductive structure body and a manufacturing method thereof. The method for manufacturing the conductive structure body according to an exemplary embodiment of the present application includes forming a metal layer on a substrate and forming a darkening layer on the metal layer, in which the forming of the darkening layer is performed by reactive sputtering using CO.


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