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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10348214 B1

PDFFull Text
Date of Patent:
Jul. 09, 2019

Filed:

Jun. 28, 2017

Power module, power converter device, and electrically powered vehicle

Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Kinya Nakatsu, Hitachinaka, JP;

Hiroshi Hozoji, Hitachiota, JP;

Takeshi Tokuyama, Hitachi, JP;

Yusuke Takagi, Hitachinaka, JP;

Toshiya Satoh, Hitachiota, JP;

Taku Oyama, Hitachi, JP;

Takanori Ninomiya, Hiratsuka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Hoa C Nguyen

Assistant Examiner:

Amol H Patel

Int. Cl.
CPC ...
H02M 7/00 (2006.01); B60L 11/18 (2006.01); H02M 7/5395 (2006.01); H05K 7/20 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 23/473 (2006.01); H01L 21/48 (2006.01); H02M 7/44 (2006.01); H01L 25/07 (2006.01); B60L 50/50 (2019.01); B60L 50/16 (2019.01); B60L 50/51 (2019.01); H02M 1/32 (2007.01); H02P 27/08 (2006.01);
U.S. Cl.
CPC ...
H02M 7/003 (2013.01); B60L 50/16 (2019.02); B60L 50/50 (2019.02); B60L 50/51 (2019.02); H01L 21/4882 (2013.01); H01L 23/36 (2013.01); H01L 23/473 (2013.01); H01L 24/33 (2013.01); H01L 25/072 (2013.01); H02M 7/44 (2013.01); H02M 7/5395 (2013.01); H05K 7/205 (2013.01); H05K 7/209 (2013.01); H05K 7/20409 (2013.01); H05K 7/20927 (2013.01); B60L 2200/26 (2013.01); B60L 2210/40 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/351 (2013.01); H02M 2001/327 (2013.01); H02P 27/08 (2013.01); Y02T 10/70 (2013.01); Y02T 10/7005 (2013.01); Y02T 10/7077 (2013.01);
Abstract

A power converter device includes a double-sided electrode module in which an electrical wiring board and a power semiconductor element are molded with a resin material. The power converter device also includes a heat dissipating base disposed on both sides of the double-sided electrode module and directly contacting cooling medium. The power converter device also includes a module fixture which presses the heat dissipating base in a state of contact with the heat dissipating base. The module fixture is configured to support a circuit board.

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