The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Mar. 02, 2017
Applicant:

Kitagawa Industries Co., Ltd., Aichi, JP;

Inventors:

Tatsuya Nakamura, Aichi, JP;

Kazushige Ueno, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H01R 12/57 (2011.01); H01R 13/24 (2006.01); H01R 4/02 (2006.01); H01R 12/70 (2011.01); H01R 43/02 (2006.01);
U.S. Cl.
CPC ...
H01R 12/57 (2013.01); H01R 4/02 (2013.01); H01R 12/707 (2013.01); H01R 13/24 (2013.01); H01R 43/0256 (2013.01);
Abstract

The contact includes a base portion, a contact portion, and a spring portion integrally molded with a thin metal plate. The spring portion includes a first bending portion, a flat plate portion, and a second bending portion. The first bending portion is bent such that a first surface of the thin plate is on an outer peripheral side, and the second bending portion is bent such that a second surface of the thin plate is on an outer peripheral side. The thin plate has a thickness t of from 0.10 to 0.15 mm, a curvature radius Rof the first bending portion is from 0.6 to 1.0 mm, and a ratio L/R1 of a length L between the first bending portion and the second bending portion of the flat plate portion to the curvature radius R1 is configured to satisfy 0<L/R1≤4.


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