The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Oct. 16, 2018
Applicant:

Lotes Co., Ltd, Keelung, TW;

Inventors:

Yung Sheng Kung, Keelung, TW;

Lu Xu, Keelung, TW;

Jian Wei Gong, Keelung, TW;

Assignee:

LOTES CO., LTD, Keelung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/02 (2006.01); H01R 13/03 (2006.01); B23K 1/08 (2006.01); B23K 1/018 (2006.01); C25D 5/12 (2006.01); H01R 43/02 (2006.01); H01R 13/187 (2006.01);
U.S. Cl.
CPC ...
H01R 4/028 (2013.01); B23K 1/018 (2013.01); B23K 1/08 (2013.01); C25D 5/12 (2013.01); H01R 4/023 (2013.01); H01R 13/03 (2013.01); H01R 43/0256 (2013.01); H01R 13/187 (2013.01);
Abstract

An electrical connector includes a barrel type terminal, having a first connecting area and a second connecting area. The first connecting area has a first non-soldering surface and a first soldering surface. The second connecting area has a second non-soldering surface and a second soldering surface. Each of the first and second soldering surfaces and the first and second non-soldering surfaces has a first solder layer. A sleeve sheathes outside the barrel type terminal, and has a first fixing area and a second fixing area. Two second solder layers are provided between the first fixing area and the first soldering surface and between the second fixing area and the second soldering surface. The amount of solder provided between the first fixing area and the first soldering surface and between the second fixing area and the second soldering surface is greater than that provided on the first and second non-soldering surfaces.


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