The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Oct. 25, 2016
Applicant:

Samsung Display Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Minho Oh, Yongin-si, KR;

Jongwoo Kim, Yongin-si, KR;

Jiyoung Moon, Yongin-si, KR;

Seungjae Lee, Yongin-si, KR;

Yoonhyeung Cho, Yongin-si, KR;

Youngcheol Joo, Yongin-si, KR;

Jaeheung Ha, Yongin-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 27/32 (2006.01); H01L 51/56 (2006.01); G02F 1/1362 (2006.01); H01L 29/786 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); G02F 1/1362 (2013.01); H01L 27/3246 (2013.01); H01L 27/3276 (2013.01); H01L 29/786 (2013.01); H01L 51/5256 (2013.01); H01L 51/56 (2013.01); G02F 2001/133357 (2013.01); G02F 2201/44 (2013.01); G02F 2201/48 (2013.01); G02F 2201/501 (2013.01); H01L 2227/323 (2013.01);
Abstract

A display device includes a display substrate including at least one step portion, and a thin film encapsulation layer above the display substrate, the thin film encapsulation layer including a buffer layer configured to reduce a height difference due to the at least one step portion and a barrier layer above the buffer layer, the buffer layer including a plurality of sub-layers and interfaces between the plurality of sub-layers, and the interfaces including a curved surface changing from a concave shape to a convex shape toward a portion overlapping the step portion from an outer portion of the step portion.


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