The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Apr. 12, 2017
Applicant:

Luminus, Inc., Sunnyvale, CA (US);

Inventors:

Kai Liu, Dublin, CA (US);

Tao Tong, Fremont, CA (US);

Assignee:

Luminus, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/107 (2006.01); H01L 33/58 (2010.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/00 (2010.01); G02B 7/02 (2006.01); G02B 19/00 (2006.01); G02B 5/08 (2006.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); G02B 7/022 (2013.01); G02B 19/0014 (2013.01); G02B 19/0061 (2013.01); H01L 33/0095 (2013.01); H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); G02B 5/0858 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A packaged UV-LED device comprises a die carrier member having a cup-shaped recess, a fused silica lens member that is anodic bonded to the die carrier member, and a UV-LED die that is flip-chip mounted within a sealed cavity formed by the carrier member and the lens member. The carrier member involves a unitary cup member fashioned in an economical way from monocrystalline silicon wafer material. A dielectric/aluminum reflector that is effective for UV radiation and that does not degrade and overheat is disposed on the sidewalls of the recess. The lens member is anodic bonded to a silicon surface of the rim of this unitary cup member at a time when the UV-LED die is disposed in the recess. The anodic bonding is done in such way that the die is not damaged and such that the entire packaged UV-LED device includes no UV-degradable adhesive.


Find Patent Forward Citations

Loading…