The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Feb. 21, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jung Hoon Kim, Hwaseong-si, KR;

Jacob-Changlin Tarn, Hwaseong-si, KR;

Il Woo Park, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/46 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/46 (2013.01); H01L 33/504 (2013.01); H01L 33/62 (2013.01); H01L 33/60 (2013.01); H01L 2224/16225 (2013.01);
Abstract

A light-emitting element mounting substrate is provided. The light-emitting element mounting substrate includes an insulating base plate comprising a first surface, a second surface facing the first surface, and a plurality of pad regions disposed on the first surface in an m-by-n matrix form, each of m and n being a natural number; a first conductive pad that is disposed in one of the plurality of pad regions and is in contact with the insulating base plate; a second conductive pad that is disposed in another one of the plurality of pad regions apart from the first conductive pad and is in contact with the insulating base plate; a first through hole disposed at a position corresponding to the first conductive pad to penetrate the insulating base plate; a second through hole that is disposed at a position corresponding to the second conductive pad to penetrate the insulating base plate and is spaced apart from the first through hole; a first through conduit filling the first through hole and being in contact with the first conductive pad; and a second through conduit filling the second through hole and being in contact with the second conductive pad.


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