The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Aug. 19, 2016
Applicant:

Csmc Technologies Fab2 Co., Ltd., Wuxi New District, CN;

Inventor:

Kui Xiao, Wuxi New District, CN;

Assignee:

CSMC TECHNOLOGIES FAB2 CO., LTD., Wuxi New District, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 29/866 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0255 (2013.01); H01L 29/0696 (2013.01); H01L 29/7813 (2013.01); H01L 29/866 (2013.01);
Abstract

Disclosed is a semiconductor device having an electrostatic discharge protection structure. The electrostatic discharge protection structure is a diode connected between a gate electrode and a source electrode of the semiconductor device. The diode comprises a diode body and two connection portions connected to two ends of the diode body and respectively used for electrically connecting to the gate electrode and the source electrode. Lower parts of the two connection portions are respectively provided with a trench. An insulation layer is provided on an inner surface of the trench and the surface of a substrate between trenches. The diode body is provided on the insulation layer on the surface of the substrate. The connection portions respectively extend downwards into respective trenches from one end of the diode body. A dielectric layer is provided on the diode, and a metal conductor layer is provided on the dielectric layer.


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