The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
Feb. 21, 2018
Applicant:
Renesas Electronics Corporation, Tokyo, JP;
Inventors:
Yuki Yagyu, Tokyo, JP;
Seiya Isozaki, Tokyo, JP;
Assignee:
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 29/792 (2006.01); H01L 27/11517 (2017.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 21/56 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); H01L 27/11517 (2013.01); H01L 29/792 (2013.01); H01L 2224/023 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05084 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05171 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4845 (2013.01);
Abstract
To provide a semiconductor device having improved reliability. A method of manufacturing the semiconductor device includes connecting a wire comprised of copper with a conductive layer formed on the pad electrode of a semiconductor chip, heat treating the semiconductor chip, and then sealing the semiconductor chip and the wire with a resin.