The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Mar. 23, 2017
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

An Huang, Shenzhen, CN;

Yanhai Lin, Shenzhen, CN;

Wei Liu, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/488 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/488 (2013.01); H01L 24/49 (2013.01); H01L 25/0655 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48011 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/4909 (2013.01); H01L 2224/4912 (2013.01); H01L 2224/49052 (2013.01); H01L 2224/49175 (2013.01); H01L 2225/06506 (2013.01); H01L 2924/00014 (2013.01);
Abstract

The application provides an apparatus, including a first section, a second section, and a first bonding wire group, where the first bonding wire group includes at least three first bonding wire units. The first bonding wire unit includes at least one arc-shaped bonding wire, one end and the other end of the first bonding wire unit are electrically connected to electrodes of the first section and the second section, respectively, where arc heights of first bonding wire units located at two sides of the first bonding wire group are higher than an arc height of a first bonding wire unit at another position, and an arc height of a first bonding wire unit located in a central area of the first bonding wire group is lower than an arc height of a first bonding wire unit at another position.


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