The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Dec. 14, 2017
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Tetsuo Yamashita, Tokyo, JP;

Tomohiro Hieda, Tokyo, JP;

Masaomi Miyazawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 23/045 (2006.01); H01L 23/10 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/4817 (2013.01); H01L 21/4875 (2013.01); H01L 21/52 (2013.01); H01L 23/045 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 24/40 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10254 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/351 (2013.01);
Abstract

According to the present invention, a semiconductor device includes a substrate having a metallic pattern formed on a top surface of the substrate, a semiconductor chip provided on the metallic pattern, a back surface electrode terminal in flat plate form connected to the metallic pattern with a wire, a front surface electrode terminal in flat plate form, the front surface electrode terminal being in parallel to the back surface electrode terminal above the back surface electrode terminal, extending immediately above the semiconductor chip, and being directly joined to a top surface of the semiconductor chip, a case surrounding the substrate and a seal material for sealing an inside of the case.


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