The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Oct. 12, 2017
Applicant:

Lapis Semiconductor Co., Ltd., Kanagawa, JP;

Inventor:

Hideaki Machida, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); G06F 17/50 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); G06F 17/5072 (2013.01); G06F 17/5077 (2013.01); H01L 23/562 (2013.01); H01L 25/18 (2013.01); H01L 23/3128 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 25/0655 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/35 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A semiconductor device includes a semiconductor chip; a substrate including a first region where the semiconductor chip is mounted and a second region separated from the first region; a conductive member provided at a second face of the substrate, the second face of the substrate is a face opposite to a first face to which the semiconductor chip is mounted; a protecting member, provided at the second face of the substrate to cover the conductive member, and including an opening partially exposing a portion of the conductive member placed at the second region; and an external connection terminal connected to the conductive member through the opening. The protecting member contacts the substrate at a portion corresponding to an outer edge of the first region.


Find Patent Forward Citations

Machida, Hideaki. (2019). Semiconductor device and wiring board design method (U.S. Patent No. 10347573). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10347573

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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