The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
Mar. 26, 2015
Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;
Michael Benedikt, Neuberg, DE;
Thomas Krebs, Mömbris, DE;
Michael Schäfer, Künzell, DE;
Wolfgang Schmitt, Rodgau, DE;
Andreas Hinrich, Freigericht, DE;
Andreas Klein, Freigericht, DE;
Alexander Brand, Elsenfeld, DE;
Martin Bleifuss, Kahl, DE;
HERAEUS DEUTSCHLAND GMBH & CO. KG, Hanau, DE;
Abstract
A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the earlier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.