The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
Oct. 21, 2016
Applicant:
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Inventor:
Kouichi Kawasaki, Kyoto, JP;
Assignee:
KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 23/12 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 23/12 (2013.01); H01L 23/49811 (2013.01); H01L 2224/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/181 (2013.01);
Abstract
The wiring board includes an insulating substrate having a main surface, an external electrode on the main surface and an outer edge portion of the insulating substrate, and a dissipating metal layer on the main surface of the insulating substrate, the dissipating metal layer having a greater area than the external electrode if viewed in a plan, the dissipating metal layer being adjacent to the external electrode and having a slit. The slit has an opening at an outer periphery of the dissipating metal layer. The external electrode faces the opening.