The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
Sep. 04, 2017
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventors:
Hiroaki Kishi, Yokohama Kanagawa, JP;
Akito Shimizu, Fuchu Tokyo, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/16 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 23/16 (2013.01); H01L 23/3114 (2013.01); H01L 23/367 (2013.01); H01L 23/3672 (2013.01); H01L 23/4334 (2013.01); H01L 23/49503 (2013.01); H01L 23/49548 (2013.01); H01L 23/49822 (2013.01); H01L 23/3107 (2013.01); H01L 23/3128 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/291 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A semiconductor package comprises a resin material, a semiconductor chip in the resin material, and a metal member in the resin material. The metal member has a first surface that faces the semiconductor chip and a second surface that is opposed to the first surface. The first surface of the metal member has a plurality of first recess portions formed thereon. The first recess portions extend into the metal member and have an opening width that is less than a bottom width.