The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
Mar. 29, 2018
Didrew Technology (Bvi) Limited, Santa Clara, CA (US);
Minghao Shen, Santa Clara, CA (US);
DIDREW TECHNOLOGY (BVI) LIMITED, Santa Clara, CA (US);
Abstract
Disclosed is a method of manufacturing a semiconductor device that includes molding and curing a framing member having an upper side that defines an array of indentations. Semiconductor dies are then adhered to the framing member within respective indentations. The upper side of the framing member and the dies are covered with an RDL. Formation of the RDL includes deposition of a dielectric material that also fills gaps between the dies and the framing member within the indentations. The framing member can be molded to have a thickness that can provide mechanical strength to resist damage to the dies during the formation of the RDL or other manufacturing processes, for example due to warping of the dies. After the RDL is completed, this excess framing member material can then be removed from lower side of the framing member and the structure can be diced to separate the dies into respective semiconductor devices.