The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Nov. 28, 2016
Applicant:

Headway Technologies, Inc., Milpitas, CA (US);

Inventors:

Yuhui Tang, Milpitas, CA (US);

Yaguang Wei, Pleasanton, CA (US);

Jiun-Ting Lee, Sunnyvale, CA (US);

Assignee:

Headway Technologies, Inc., Milpitas, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/11 (2006.01); G11B 5/31 (2006.01); G11B 5/127 (2006.01); G11B 5/187 (2006.01); G11B 5/235 (2006.01);
U.S. Cl.
CPC ...
G11B 5/112 (2013.01); G11B 5/127 (2013.01); G11B 5/1278 (2013.01); G11B 5/187 (2013.01); G11B 5/235 (2013.01); G11B 5/313 (2013.01); G11B 5/315 (2013.01); G11B 5/3116 (2013.01); G11B 5/3146 (2013.01); G11B 5/3169 (2013.01); G11B 5/3143 (2013.01); G11B 5/3163 (2013.01);
Abstract

A method is disclosed for forming a perpendicular magnetic recording writer with an all wrap around (AWA) shield design wherein one or more of the leading shield, trailing shield, and side shields are a composite wherein a magnetic 'hot seed' layer made of a >19 kG to 24 kG material adjoins a gap layer, and a side of the hot seed layer opposite the gap layer adjoins a high damping magnetic layer made of a 10-16 kG material (or a 16-19 kG material in the trailing shield) having a Gilbert damping parameter α>0.04. In one embodiment, the high damping magnetic layer is FeNiRe with a Re content of 3 to 15 atomic %. The main pole leading and trailing sides may be tapered. Side shields may have a single taper or dual taper structure. Higher writer speed with greater areal density capability is achieved.


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