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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10345936 B1

PDFFull Text
Expired
Date of Patent:
Jul. 09, 2019

Filed:

May. 17, 2016

Method for producing conductor-layer-provided structure, substrate-provided wiring body, substrate-provided structure, and touch sensor

Applicant:

Fujikura Ltd., Tokyo, JP;

Inventors:

Shingo Ogura, Chiba, JP;

Takaharu Hondo, Chiba, JP;

Takeshi Shiojiri, Chiba, JP;

Assignee:

FUJIKURA LTD., Tokyo, JP;

Attorney:

Osha Liang LLP

Primary Examiner:

Timothy J Thompson

Assistant Examiner:

Charles Pizzuto

Int. Cl.
CPC ...
G06F 3/041 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); G06F 3/044 (2006.01); H01B 5/14 (2006.01); H01B 13/00 (2006.01); H05K 3/20 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
G06F 3/041 (2013.01); G06F 3/044 (2013.01); H01B 5/14 (2013.01); H01B 13/00 (2013.01); H05K 1/18 (2013.01); H05K 3/20 (2013.01); H05K 3/38 (2013.01); H05K 3/4682 (2013.01); G06F 2203/04103 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer that includes a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer that includes a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

Find Patent Forward Citations

Ogura, Shingo. (2019). Method for producing conductor-layer-provided structure, substrate-provided wiring body, substrate-provided structure, and touch sensor (U.S. Patent No. 10345936). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10345936

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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